Diferentes estratégias adesivas na resistência de união entre material de pino de fibra de vidro e resina composta

Abstract

Introduction: Studies about adhesion in relation to different surface treatments of glass fiber post and composite resin are required to try avoid interface failures and to improve the adhesion of the restoration in cases of large coronary destruction. Objective: To compare different adhesive strategies on the bond strength between glass fiber post and composite resin. Materials and Methods: Thirty-six glass fiber blocks were divided into twelve groups. Each group consisted of three fiber blocks, where the following surface treatment was performed: pre treatment (control, sandblasting and hydrogen peroxide) and chemical treatment (no treatment, Monobond Plus, Relyx Ceramic Primer and Single Bond Universal (SBU)). After that, 6 starch tube were putted on each block and filled with composite resin (n=18). After 24 hours microshear test was performed. Failure analysis was observed under stereomicroscope. The data obtained were submitted to two-way ANOVA and Tukey test (p=0.05). Results: The statistical analysis revealed the type of pre treatment (p<0.0001) and chemical treatment (p<0.0001) affected the bond strength values. The data obtained were submitted to two-way ANOVA and Tukey test (p=0.05). The statistical analysis revealed the type of pre treatment (p<0.0001) and chemical treatment (p<0.0001) affected the bond strength values. The sandblasting obtained statistically higher values for pre treatment, except for the SBU. While Single Bond Universal obtained statistically higher values for chemical treatment when no mechanical treatment was carried out. Only one specimen showed cohesive failure. Conclusion: According to this finds, for bonding between glass fiber post and composite, the sandblasting obtained statistically higher values for mechanical treatment, and Single Bond Universal obtained statistically higher values for chemical treatment when no mechanical treatment was carried out.