Análise eletrotérmica e eletromagnética de placas de circuito impresso com alta densidade de potência utilizando engenharia assistida por computador

Abstract

The objective of this work is to use Computer-aided engineering (CAE) to simulate the electrothermal and electromagnetic behavior of printed circuit boards (PCBs) with high power density. PCBs are widely used in various electronic equipment and their manufacture requires the application of good practices. Using CAE to predict the thermal and electromagnetic behavior of a PCB is an intelligent solution to minimize rework resulting from temperature and electromagnetic compatibility (EMC) problems, as it allows evaluating different scenarios with reduced costs. In this work, two PCB models of the same circuit will be presented, each with different characteristics. The first PCB is designed with the aim of offering better thermal efficiency to the circuit, while the second seeks to optimize electromagnetic efficiency. Both PCB models use the topology of a 100W Synchronous Boost converter, which operates at a switching frequency of 350kHz. These models served as practical examples to validate the thermal and electromagnetic performance simulations. The simulation results revealed significant differences between the two PCB models. The 2-layer PCB has demonstrated remarkable heat dissipation capabilities, making it suitable for applications that require effective temperature management. However, it presented a lower efficiency in electrical conduction, which must be taken into consideration in applications sensitive to energy loss. On the other hand, the 4-layer PCB exhibited inferior heat dissipation capacity, suggesting that it may not be the best choice in high power density situations. However, it stood out for its greater efficiency in electrical conduction, making it ideal for applications that demand effective energy transmission. Additionally, this PCB has demonstrated a remarkable ability to mitigate electromagnetic interference, which is critical in environments where EMC is a critical concern. Through these simulations, a roadmap was developed that can identify possible PCB solutions, streamlining and optimizing project development, with practices that aim to minimize thermal management and electromagnetic compatibility problems, as well as other common problems in high power density PCBs. This analysis model will make it easier to identify practical solutions and improvements for the construction of PCBs with high power density, aiming to improve thermal management and electromagnetic compatibility, in addition to contributing to a more efficient and optimized development of these devices.